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    [Pangyo Tech] Hancom Intelligence holds electronic circuit board technology seminar ‘The Next PCB 2022’

    Photo courtesy of Hancom Intelligence

    Hancom Intelligence, a consolidated subsidiary of Hancom MDS, announced that it will hold ‘The Next PCB 2022’ technology seminar for engineers using electronic circuit board (PCB) design solutions for two days starting on the 25th. This seminar will be held in a virtual conference hall consisting of the first and second floors in the metaverse space to enable two-way communication with attendees, and it will be possible to view Hancom Intelligence’s various products as well as participate in promotions and events. In addition, new features of ‘Altium Designer 22’, the latest version of ‘Altium Designer’, a PCB design solution highly preferred by developers around the world, will be released, and will comply with the ‘IPC standard’, an international standard for electronics industry knowledge. This introduces new functions that can be designed. In the afternoon of this day, a case of successful construction of the cloud-based platform ‘Altium 365’ product was presented, and a method was provided to quickly and easily share PCB designs between designers, component suppliers, and manufacturers, and to efficiently manage project history. introduced. On the afternoon of the 26th, various methods will be shared to help engineers solve the difficulties they face while carrying out design work. Since 2018, Hancom Intelligence has been expanding its base in the domestic EDA market through a strategic business partnership with ‘Altium’, a global electronic design automation (EDA) specialist company, and has been expanding its electronic circuit board (PCB)-related technology every year. We are holding a conference. Seo Sang-soo, Chief Operating Officer (COO) of Hancom Intelligence, said, “As a reliable technology partner for our customers, Hancom Intelligence will alleviate difficulties in business and support them to respond flexibly in a rapidly changing market.” “We will actively interact by diversifying communication channels that combine face-to-face channels,” he said.

    Source:  Pangyo Techno Valley Official Newsroom

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