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    SK Hynix participates in CES 2023… A large number of new high-efficiency, high-performance memory products released!

    New memory semiconductor products to be introduced by SK Hynix at CES 2023 | Source - SK Hynix
    New memory semiconductor products to be introduced by SK Hynix at CES 2023 | Source – SK Hynix

    SK Hynix announced on the 1th that it will participate in ‘CES 5’, the world’s largest IT and home appliance exhibition, opening in Las Vegas, USA on January 2023 (local time) and introduce a large number of its flagship memory products and new products.

    At this CES, SK Hynix will showcase products with dramatically reduced carbon emissions in line with SK Group’s direction of ‘carbon-free future’ under the theme of ‘green digital solutions’. SK Hynix explains that these products are expected to attract the attention of global big tech customers and experts by not only reducing environmental impact but also significantly improving performance and efficiency compared to the previous generation.

    Recently, the growth rate of high-tech industries such as artificial intelligence (AI), big data, autonomous driving, and metaverse has rapidly increased, and global technology companies are paying attention to memory semiconductors that increase energy efficiency while quickly processing rapidly increasing data.

    SK Hynix’s representative product at this CES is ‘PS1010 E3.S’, an ultra-high performance enterprise solid state drive (SSD). This is a package product manufactured by combining multiple 176-layer 4D NAND from SK Hynix, and supports the 5th generation of PCIe (high-speed input/output interface). In addition, PS1010 has improved read and write speeds by up to 130% and 49%, respectively, compared to the previous generation, and is expected to lower customers’ server operating costs and carbon emissions with an improved performance ratio of more than 75%.

    In addition, SK Hynix is ​​a next-generation memory product suitable for high-performance computing (HPC) environments, including the 3rd generation product of ‘HBM’, the highest-performance DRAM in existence, and ‘GDDR6-AiM’, which uses process-in-memory (PIM) technology that adds computational functions to memory. ‘, and ‘CXL (Compute Express Link) memory’ that flexibly expands memory capacity and performance.

    At the same time, SK Hynix will also exhibit the ‘Immersion Cooling’ technology of SK Nmove, an energy efficiency company of SK Group, at the CES booth. Immersion cooling is a technology that lowers the operating temperature of servers equipped with semiconductors, and SK Hynix plans to continue to expand collaboration with group affiliates as well as external partners to create new added value throughout the semiconductor business.

    SK Hynix technical staff explained, “As the server memory market continues to grow even in a downturn, we have timely unveiled a new product that integrates our technology, which is the most competitive in the industry.”

    Jae-yeon Yoon, vice president of NAND product planning at SK Hynix, said, “We expect that the competitiveness of the company’s NAND business will be further strengthened based on ultra-high-performance products equipped with self-developed controllers and firmware.”

    Meanwhile, ‘CES’, the world’s largest IT exhibition, is an exhibition where you can understand the trends of the global home appliance industry at a glance. Hosted by the Consumer Technology Association (CTA), it is held every January in Las Vegas, USA. AVING News, which has covered CES for 1 consecutive years, has reported CES news around the world every year since 17, and has been selected as the ‘BEST OF CES’, which selects the best innovative products and technologies, and the ‘BEST OF’, which selects domestic innovative companies. ‘MADE IN KOREA’ was held. In addition, CES on-site issues were vividly conveyed through ‘AVING LIVE’.

    → Go to the CES 2023 news special page